A PRACTICAL APPROACH TO ELECTROMAGNETIC COMPATIBILITY
Revised Ed : 2024
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Pages : 404
Price : Rs 900/-
Edition: 2024.
Publisher : EMC Publications, Pune
Author : Chetan Kathalay -A distinguished Scientist and Director (Retd.) ETDC, Govt. of India, STQC Directorate, Pune.
This
book is intended for readers who are interested in the practical aspects
of EMC testing and compliance rather than complicated mathematical derivations.
It has been designed in such a way that the reader will be able to pick up the
concepts and incorporate them right away in the design without worrying too
much about theory. For the Indian manufacturer, it will not only save money
involved in buying costly books by foreign authors but also spare them of
incessant surfing on the internet (which only results in conflicting and
confusing ideas).
The
book is conveniently divided into two parts.
Part
I of the book deals with fundamentals, standards and test methodologies. This
part helps the reader to develop a thorough understanding of the EMI
phenomenon, contents of EMC standards and details of EMC testing. It has six
chapters namely EMC fundamentals, EMC Standards, Conducted Emission
measurement, Radiated Emission measurement, Conducted Immunity testing and
Radiated Immunity testing.
Part
II of the book has five chapters on EMC design namely Line Filtering, Shielding,
PCB design, Grounding & Bonding and Cable Selection & Routing. These
chapters will enable the reader to thoroughly understand all EMC design
methodologies and encourage him/her to incorporate EMI suppression measures in
the design stage of itself. This will avoid costly retrofits at the eleventh
hour which not only add to equipment cost but also lead to loss of precious
time.
And
last but not the least, the book ends with an introduction to CE marking - a
mandatory compliance mark placed on products intended for export to the European Union.
CONTENTS
CHAPTER 1 : INTRODUCTION TO EMI/EMC.
1.1 WHAT IS EMI/RFI?
1.2 HISTORY OF EMI
1.3 THE PROBLEM OF EMI
1.4 EFFECTS OF EMI
1.5 NEED FOR EMC
1.6 REALISATION OF EMC
1.7 EMC TESTS AND MEASUREMENT
1.8 ELEMENTS OF EMI
1.9 COUPLING MECHANISMS
1.10 EMI VICTIMS
1.11. CONCLUSION
CHAPTER 2. EMC STANDARDS
2.1 INTRODUCTION
2.2 CONTENTS OF EMC STANDARDS
2.3 TYPES OF EMC STANDARDS
2.4 CIVILIAN EMC STANDARDS
2.4.1 International Electrotechnical
Commission (IEC) (Www.IEC.Ch)
2.4.2 IEC EMC Standards
2.4.3 Type Of IEC Standards
2.4.3.2 Product Standards :
2.4.3.3 Generic Standards :.
2.4.4 Basic Standards And Tc-77
2.4.5 Overview Of IEC Basic Standards
2.4.6 IEC 61000-3- Series
2.4.7 IEC 61000-4 Series Of Basic Standards
2.4.8 IEC Generic Standards
2.4.9 CISPR Standards
2.4.12 Frequently Referred CISPR Standards
2.4.13 IEC Automotive Standards
2.4.14 Automotive Emission Standards
2.4.15 Automotive Susceptibility/Immunity Standards
2.4.16 Indian Standards (Is)
2.4.17 European Standards
2.4.18 Cenelec Historical Background
2.4.19 Cenelec Structure
2.4.20 Membership
2.4.21 Other European Standards Organizations
2.4.22 The Making Of An En Standard
2.4.23 European EMC Standards
2.4.24 Federal Communcations Commission (FCC) Standards
2.4.25 FCC Part
15 : Radio Devices
2.4.26 FCC Part 18—Industrial, Scientific, And Medical
Equipment
2.4.27 FCC Procedures For Showing Conformance
2.5 MILITARY EMC STANDARDS
2.6 INTRODUCTION TO EMC TESTING
CHAPTER 3 CONDUCTED EMISSION (CE)
MEASUREMENT
3.1 INTRODUCTION
3.2 TEST SETUP
3.3
MEASUREMENT INSTRUMENTATION
3.4
EMI RECEIVER
3.5.
RECEIVER STAGES IN DETAIL
3.5.2
Pre-selector and RF amplifier
3.5.3 Mixer
3.5.4 IF
Amplifier
3.5.5
Detectors
3.5.6. Peak
Detector
3.5.7.
Quasi-peak (QP) detector
3.5.8.
Average Detector
3.5.9. RMS
detector
3.5.10.
RMS-average detector
3.5.11 EMI
Receiver Vs Spectrum Analyzer.
3.6
UNITS OF MEASUREMENT.
3.7
CONDUCTED EMISSION LIMITS
3.8
LABORATORY TEST SETUP
3.9.
EUT CONFIGURATION
3.10.
MEASUREMENT PROCEDURE
3.11.
DISCONTINUOUS EMISSION OR CLICKS.
3.12
MEASUREMENT OF CLICKS.
3.13
LOW FREQUENCY CONDUCTED EMISSION: HARMONICS
3.14.
LOW FREQUENCY CONDUCTED EMISSION: FLICKER
3.15
TEST REPORTS
3.16
REFERENCES
CHAPTER 4 RADIATED EMISSION (RE)
MEASUREMENT
4.1 INTRODUCTION
4.2 BASIC TEST SETUP
4.3 MEASUREMENT INSTRUMENTATION
4.3.1 EMI Receiver
4.3.2. Antennas
4.3.3. Antenna Factor (AF)
4.4 UNITS OF MEASUREMENT
4.5 FREQUENCY RANGE OF MEASUREMENT
4.6 LIMITS4.7 MEASUREMENT SITE
4.7.1. Open Area Test Site (OATS
4.7.5 Anechoic
Chambers
4.7.6 Transverse Electro-Magnetic (TEM) CELLs
4.8. RADIATED EMISSION MEASUREMENT PROCEDURE
4.9 DISTURBANCE POWER MEASUREMENT
4.10 NEAR FIELD EMISSION MEASUREMENT
4.11 TEST REPORTS
4.12 CONCLUSION
CHAPTER 5. CONDUCTED
IMMUNITY/SUSCEPTIBILITY TESTING
5.1 INTRODUCTION
5.2 GENERAL TEST SETUP
5.3 ELECTRICAL FAST
TRANSIENTS / BURST (EFT/B)
5.4 SURGE TESTING
5.5. CONDUCTED SUSCEPTIBILITY
--CONTINUOUS WAVE.
5.6 ELECTROSTATIC DISCHARGE TEST
5.7. EVALUATION OF TEST RESULTS
5.8. TEST REPORT
5.9. CONCLUSION
CHAPTER 6 : RADIATED
SUSCEPTIBILITY/IMMUNITY TESTING
6.1 INTRODUCTION
6.2. GENERAL TEST SET-UP.
6.3. SHILEDED ENCLOSURES
6.4. ANTENNAS
6.5. SIGNAL GENERATORS AND AMPLIFIERS
6.6. MEASURING EQUIPMENT
6.7. ANCILLARY EQUIPMENT
6.8. SEVERITY LEVELS AND FREQUENCY
RANGES
6.9. FIELD CALIBRATION.
6.10. TEST PROCEDURE
6.11. ALTERNATE TEST METHOD
6.12. TESTING IN A GTEM CELL
6.13 EVALUATION OF TEST RESULTS AND TEST REPORTS
CHAPTER 7. FILTERING
7.1. INTRODUCTION
7.2. FILTER TYPES
7.3. FILTER IMPEDANCE
7.4. POWER LINE FILTERS
7.5. BASIC ELEMENTS OF FILTERS
7.5.1. Common Mode Choke
7.5.5. X Capacitors
7.5.8. Y Capacitors
7.6 POWER LINE FILTER DESIGN
7.6.2 Filter design approach-1.
7.6.3. Filter design approach-2
7.6.3.2. Values of common mode components.
7.6.3.3. Determining differential mode (DM) attenuation.
7.6.3.4. Values of differential mode components.
7.7. OTHER FILTER COMPONENTS
7.7.1. Metal Oxide Varistors
7.7.2. Gas Discharge Tubes (GDT)
7.7.2.1. Working
7.7.3. Transient Voltage Supressors (TVS) / Silicon
Avalanche Suppressors (SAS).
7.7.4. Hybrid transient suppressors
7.8. TRANSIENT SUPPRESSIONS IN RELAYS
AND MOTORS
7.9. MULTISTAGE POWER LINE FILTERS
7.10. FERRITEs
7.11. FILTERS FOR DC LINES
7.12. FILTERS FOR DATA CABLES7.13. FILTERED PIN CONNECTORS
7.14. FILTER INSTALLATION7.15 FILTER PERFORMANCE EVALUATION
7.16 CONCLUSION.
CHAPTER 8. SHIELDING
8.1. INTRODUCTION
8.2. MECHANISM OF RADIATION
8.3. SHIELDING MECHANISMS
8.4 CHOICE OF SHIELD MATERIAL
8.6. PENETRATIONS AND APERTURES
8.6.5 Ventilation Louvers And Holes
8.6.7. Keypad And Displays
8.7 LEAKAGES AT SEAMS
8.7.1.EMC gaskets.
8.7.7. Metallic Finger-Stock
8.7.10Shielding For Connector Openings
8.7.11Shielding Of Plastic Enclosures
8.8. SHIELDS FOR CABLES
8.9. CONCLUSION.
CHAPTER 9. PCB DESIGN FOR EMC
9.1 NEED FOR EMC DESIGN AT PCB
LEVEL.
9.2 PRINTED CIRCUIT BOARD (PCB)
9.3 BOARD ZONING
9.4 ASPECTS OF A GOOD PCB DESIGN
9.5 COMMON IMPEDANCE COUPLING IN PCBs
9.6. GENERAL CONSIDERATIONS FOR A PCB
9.6.1.Supply entry
9.6.2 Entry of digital and analog inputs
9.6.3. Bypass capacitors
9.6.4. Supply distribution
9.6.5. Decoupling and bulk decoupling capacitors
9.6.6. Connecting load capacitors of crystal to
microcontroller ground.
9.7. MULTILAYER BOARD AND HIGH
SPEED PCB DESIGN
9.8 MULTILAYER CONCEPTS
9.8.1. Board Stack-up
9.8.2. Power and ground planes
9.8.4. Reducing cross-talk –The 3W Rule
9.8.5. Guard traces
9.9. POWER AND GROUND PLANES
9.10. PLANE RESONANCE
9.11. RESONANCE BETWEEN PLANE PAIRS
9.13. HOLES AND DISCONTINUITIES IN
GROUND PLANE.
9.14 ANTIPAD DESIGN
9.15 ROUTING TRACES NEAR ANTIPADS AND
SLOTS
9.16. PROBLEMS WITH SPLIT PLANE
9.17. WHEN TRACE CHANGES LAYERS
9.18. CONNECTING DEVICES TO PLANES
9.19. DECOUPLING CAPACITOR PLACEMENT
9.20. USING MULTIPLE DECAPS IN
PARALLEL
9.21. DEVICE PLACEMENT
9.22. BOARD STACKING
9.22.3. Board stacking of eight layer PCB
9.22.2 Board stacking of six layer PCB
9.23. MICROVIA / HDI TECHNOLOGy
9.24. SEGREGATION
9.24.1. Segregation using filters
9.24.1.1. SMD filter components
9.24.1.2. RF reference
9.24.1.3. Filter for data lines
9.24.1.4. Filter for unshielded off board connector
9.24.2 Segregation using board level shielding
9.24.2.1 Interconnections to components inside a shielding
can
CHAPTER 10. GROUNDING AND BONDING
10.1. INTRODUCTION
10.2. PURPOSE OF GROUNDING
10.3. STANDARDS REGARDING SAFETY
GROUND
10.4. EQUIPMENT AND SYSTEM GROUNDING
10.5. TYPES OF GROUNDING
10.6. REDUCING COMMON GROUND IMPEDANCE
COUPLING
10.7. GROUNDING OF CABLE SHIELDS
10.8. GROUNDING OF FARADAY SHIELDED
TRANSFORMER
10.9. EARTH PITS
10.10 ELECTRICAL BONDING
10.10.1. Effects of improper bonding
10.10.2. Behaviour of a bond at radio frequencies
10.10.3. Types of bonding
10.10.4. Surface treatment
10.10.5. Mitigation of
corrosion.
10.10.6. Bonding practices
10.10.7. Bonding of protective earth wire
10.10.8. Bonding of internal protective earth wires
10.10.9. Bonding of mounting plate to the chassis/
electronic cabinet
10.10.10 Bonding screened cables with connectors
10.10.11. Bonding screened cables that have no connectors
10.10.12. Bonding of connector panels
10.10.13. bonding of connectors on connector panel
10.10.14 Bonding of metal cableways.
CHAPTER 11 CABLE SELECTION AND ROUTING
11.1 Introduction
11.2. Cable Coupling Mechanisms
11.3. Running Cables In An
Installation
11.4.Shape Of Cable Ways
11.5. Cable Classes
11.6. Type Of Cables For A Particular
Class
11.7. Cable Segregation
11.8. Reducing Common Mode Coupling
11.9. Reducing Differential Mode
Coupling
11.10. Cable Routing In An Electronics
Control Panel
CHAPTER 12. CE MARKING
12.1. Introduction
12.2. The European Union Background
12.3. Eu Institutional Structure
12.4. Type Of Legislative Actions
12.5. Ce Marking And Other Marks
12.6. Essential Requirements Of Ce Marking
12.7. The New Approach To Conformity
12.8. Eu Directives12.9. Harmonized European Standards
12.10. The Global Approach To Conformity
12.11. Notified Bodies
12.12. The Ce Marking Procedure
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