EMC Testing and Design Aspects Course

COURSE ON EMC TESTING AND DESIGN ASPECTS

Preamble:

 Given the scorching pace at which electronic equipment are evolving, untoward problems like Electromagnetic Interference (EMI) are rising day-by-day. Testing and proper design has therefore become essential to ensure Electromagnetic Compatibility (EMC) for a particular product so that EMI emission is kept below limit and at the same time maintaining a certain level of immunity to external EMI.EMI/EMC awareness is increasing day by day and many industries and government departments are demanding EMI compliant products. Moreover, EMI/EMC testing and compliance is an essential requirement of various international certifications like CE marking.  

Utility of the course :

This course will help in developing a thorough understanding of the EMI phenomenon, testing and design aspects for EMC. It is quite often seen that ignoring EMC aspects at beginning of the product development cycle stage translates into heavy losses in terms of time and money because of the inherent difficulties in modifying a frozen design. Ensuring EMC at design stage is therefore the need of the hour as it helps to keep equipment costs low so as to maintain a competitive edge. This course aims at introducing the design engineer to various EMC tests and design aspects and how to comply with them. It will help him to incorporate EMC at design stage itself so that the entire process of EMC compliance becomes smooth.

Course content: (Scroll down for detailed course content)

 DAY 1* 

• Fundamentals of EMI/EMC
• Overview Of EMC Design
• Line filtering & transient suppression 
• Grounding and Bonding

DAY 2 : 

• Shielding techniques
• High speed PCB design for EMC
• Cable   selection and routing

Target Group: Managers/ Engineers involved in design, quality control and production. 

Course Duration: Two days (8 hours each day).

Mode : On-line

Faculty: Mr Chetan R Kathalay Ex-Director, ETDC Pune, having a vast experience of about 27 years in EMC testing and design. He has provided guidance twards EMI hardening for a plethora of products.

Certificate: Participants will get participation certificate and soft copy of courseware

Course Fees: INR 4000/- (plus 18% GST) in advance.

Method of Registration: Click here for registration

Payment: 

UPI

UPI-Id: chetankathalay@yesbank

IMPS/NEFT/RTGS

Bank : Yes Bank

Acct no.: 039761900002290

Acct Name : Euroconform Affirma

IFSC :YESB0000397

Address : Kalyani nagar, Pune

For all your training needs, you can contact us directly at chetankathalay@gmail.com or DM to +91 8999825887

  

DETAILED COURSE CONTENT

 Fundamentals of EMI/EMC

~ Definitions

~ Sources of EMI

~ Origin of fields

~ EMI modes

~ Coupling Mechanisms

~ Affect on victim

Line filtering & transient suppression (50 slides)

~ Filter types

~ Basic Elements/Components

~ Power Line filter configuration

~ Core Materials

~ X and Y Capacitors

~ Filter Design Methodology

~ Transient Suppression Components (MoVs, SAS, TVS diodes)

~ Ferrites

~ Filters for DC and data lines

~ Filter Installation

Grounding and Bonding (20 Slides)

~ Purpose of Grounding

~ Types of Grounding

~ What is Bonding

~ Effects of Improper Bonding

~ Bond Types

~ Bonding of Screened Cables

~ Bonding of connector panels

~ Bonding of Earth wire.

Shielding techniques (52 Slides)

~ Type of fields

~ Near Fields and Far Fields

~ Barrier Impedance and Skin Depth

~ Shielding effectiveness

~ Reflection and Absorption

~ Shield design for Electric field, Magnetic Field and Plane Waves

~ Ensuring Shielding Over Display, Keypads and Ventilation Openings

~ Ensuring Shielding Over Seams using Gaskets and Fingerstock

~ Ensuring Shielding Over Cable Entries

 High speed PCB design (40 slides)

~ Need for EMC at PCB level

~ Printed Circuit Board Terminology

~ Digital Circuit Layout And Noise

~ Reduction Of Ground Track Inductance

~ Reservoir/Decoupling Capacitors

~ Common Impedance Coupling In PCBs

~ Need For Multilayer Boards

~ Multilayer Concepts

~ Power And Ground Planes

~ Openings on planes

~ Issues with Split Planes

~ Traces Crossing Layers

~ Connection Of Devices To Planes

~ Layer Stacking In Boards

~ HDI Technology

~ Board Segregation

Cable selection and routing(20 Slides)

~ Cable Coupling Mechanisms

~ Cable Classes

~ Cable Segregation

~ Reducing Cable Coupling

~ Cable Routing In Electronics Control Panel